MCP6401/1R/1U/2/4/6/7/9
AC ELECTRICAL SPECIFICATIONS
Electrical Characteristics: Unless otherwise indicated, TA = +25°C, VDD = +1.8 to +6.0V, VSS = GND, VCM = VDD/2,
VOUT ≈ VDD/2, VL = VDD/2, RL = 100 kΩ to VL and CL = 60 pF (Refer to Figure 1-1).
Parameters
Sym
Min Typ Max
Units
Part
Conditions
AC Response
Gain Bandwidth Product
GBWP
—
1
—
MHz
E, H
Phase Margin
PM
—
65
—
°
E, H G = +1 V/V
Slew Rate
SR
—
0.5
—
V/µs
E, H
Noise
Input Noise Voltage
Eni
Input Noise Voltage Density
eni
Input Noise Current Density
ini
—
3.6
—
µVp-p
E, H f = 0.1 Hz to 10 Hz
—
28
—
nV/√Hz
E, H f = 1 kHz
—
0.6
—
fA/√Hz
E, H f = 1 kHz
TEMPERATURE SPECIFICATIONS
Electrical Characteristics: Unless otherwise indicated, VDD = +1.8V to +6.0V and VSS = GND.
Parameters
Sym
Min
Typ
Max Units
Conditions
Temperature Ranges
Operating Temperature Range
Storage Temperature Range
Thermal Package Resistances
TA
-40
—
+125
°C E temp parts (Note 1)
TA
-40
—
+150
°C H temp parts (Note 1)
TA
-65
—
+155
°C
Thermal Resistance, 5L-SOT-23
θJA
—
220.7
—
°C/W
Thermal Resistance, 8L-SOIC
θJA
—
149.5
—
°C/W
Thermal Resistance, 14L-SOIC
θJA
—
95.3
—
°C/W
Note 1: The internal junction temperature (TJ) must not exceed the absolute maximum specification of +155°C.
1.4 Test Circuits
The circuit used for most DC and AC tests is shown in
Figure 1-1. This circuit can independently set VCM and
VOUT; see Equation 1-1. Note that VCM is not the
circuit’s Common Mode voltage ((VP + VM)/2), and that
VOST includes VOS plus the effects (on the input offset
error, VOST) of temperature, CMRR, PSRR and AOL.
EQUATION 1-1:
GDM = RF ⁄ RG
VCM = (VP + VDD ⁄ 2) ⁄ 2
VOST = VIN– – VIN+
VOUT = (VDD ⁄ 2) + (VP – VM) + VOST(1 + GDM)
Where:
GDM = Differential Mode Gain
VCM = Op Amp’s Common Mode
Input Voltage
VOST = Op Amp’s Total Input Offset
Voltage
(V/V)
(V)
(mV)
CF
6.8 pF
RG
100 kΩ
VP
VIN+
RF
100 kΩ
MCP640x
VIN–
VM
RG
100 kΩ
RF
100 kΩ
VDD
VDD/2
CB1
100 nF
CB2
1 µF
VOUT
RL
CL
100 kΩ 60 pF
CF
6.8 pF
VL
FIGURE 1-1:
AC and DC Test Circuit for
Most Specifications.
DS22229D-page 8
© 2009-2011 Microchip Technology Inc.