.810 MAX.
LEAD 1 INDICATOR
0.016 ±.002
.050
.600 MAX.
.400 MIN.
0.130 MAX.
Notes:
1. Package material: opaque ceramic.
2. All package plating finishes are per MIL-PRF-38535.
3. It is recommended that package ceramic be mounted to a heat removal rail located in the
printed circuit board. A thermally conductive material should be used.
.010 + .002 - .001
0.070 ±0.010
(AT CERAMIC BODY)
Figure 15. 24-Lead Flatpack, Dual Cavity
(50-mil lead spacing)
16