UT54LVDS032LVT View Datasheet(PDF) - Aeroflex Corporation
Part Name
Description
Manufacturer
UT54LVDS032LVT Datasheet PDF : 11 Pages
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AC SWITCHING CHARACTERISTICS1, 2, 3
(VDD = +3.3V + 0.3V, TA = -55 °C to +125 °C)
SYMBOL
PARAMETER
tPHLD6
Differential Propagation Delay High to Low
CL = 10pf (figures 4 and 5)
tPLHD6
Differential Propagation Delay Low to High
CL = 10pf (figures 4 and 5)
tSKD4
Differential Skew (tPHLD - tPLHD) (figures 4 and 5)
tSK14
Channel-to-Channel Skew1 (figures 4 and 5)
tSK24
Chip-to-Chip Skew5 (figures 4 and 5)
tTLH4
Rise Time (figures 4 and 5)
tTHL4
Fall Time (figures 4 and 5)
tPHZ4
Disable Time High to Z (figures 6 and 7)
tPLZ4
Disable Time Low to Z (figures 6 and 7)
tPZH4
Enable Time Z to High (figures 6 and 7)
tPZL4
Enable Time Z to Low (figures 6 and 7)
MIN
1.8
1.8
0
0
MAX
3.3
3.3
0.35
0.5
1.5
1.2
1.2
12
12
12
12
UNIT
ns
ns
ns
ns
ns
ns
ns
ns
ns
ns
ns
Notes:
1. Channel-to-Channel Skew is defined as the difference between the propagation delay of the channel and the other channels in the same chip with an event on the
inputs.
2. Generator waveform for all tests unless otherwise specified: f = 1 MHz, Z0 = 50Ω, tr and tf (0% - 100%) < 1ns for RIN and tr and tf < 1ns for EN or EN.
3. CL includes probe and jig capacitance.
4. Guaranteed by characterization.
5. Chip to Chip Skew is defined as the difference between the minimum and maximum specified differential propagation delays.
6. May be tested at higher load capacitance and the limit interpolated from characterization data to guarantee this parameter.
5
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