5962-88768 View Datasheet(PDF) - Broadcom Corporation
Part Name
Description
Manufacturer
5962-88768 Datasheet PDF : 15 Pages
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HCPL-520x, HCPL-523x, HCPL-623x, HCPL-625x, 5962-88768 and 5962-88769
Data Sheet
Functional Diagram
Functional Diagram
Multiple-channel devices are available.
Truth Tables
(Positive Logic)
V CC
VO
VE
GND
Package styles for these parts are 8-pin DIP through hole (case
outline P), 16-pin DIP flat pack (case outline F), and leadless
ceramic chip carrier (case outline 2). Devices can be purchased
with a variety of lead bend and plating options. See Selection
Guide–Package Styles and Lead Configuration Options for
details. Standard Microcircuit Drawing (SMD) parts are
available for each package and lead style.
Because the same electrical die (emitters and detectors) are
used for each channel of each device listed in this data sheet,
absolute maximum ratings, recommended operating
conditions, electrical specifications, and performance
characteristics shown in the figures are identical for all parts.
Occasional exceptions exist due to package variations and
limitations and are as noted. Additionally, the same package
assembly processes are used in all devices. These similarities
give justification for the use of data obtained from one part to
represent other part’s performance for die related reliability
and certain limited radiation test results.
Multichannel Devices
Input
On (H)
Output
H
Off (L)
L
Single Channel Devices
Input
Enable
Output
On (H)
H
Z
Off (L)
H
Z
On (H)
L
H
Off (L)
L
L
NOTE A 0.1-μF bypass capacitor must be connected
between VCC and GND pins.
Functional Diagrams
8-Pin DIP
Through Hole
1 Channel
1
V CC
8
1
2
VO
7
2
3
VE
6
3
4
5
4
GND
8-Pin DIP
Through Hole
2 Channels
V CC
8
V O1
7
V O2
6
GND
5
16-Pin Flat Pack
Unformed Leads
4 Channels
1
16
2
VCC 15
3
VO1 14
4
VO2 13
5
VO3 12
6
VO4 11
7
GND 10
8
9
20-Pad LCCC
Surface Mount
2 Channels
15
V CC2
19
V O2
13
20
GND 2 12
2
VO1 VCC1 10
3
GND 1
78
NOTE Multichannel DIP and flat pack devices have common VCC and ground. Single-channel DIP has an enable pin 6.
LCCC (leadless ceramic chip carrier) package has isolated channels with separate VCC and ground connections.
All diagrams are top view.
Broadcom
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