MSA-0300 View Datasheet(PDF) - Avago Technologies
Part Name
Description
Manufacturer
MSA-0300 Datasheet PDF : 4 Pages
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MSA-0300 Chip Dimensions
NOT APPLICABLE
INPUT
365 µm
14.4 mil
GROUND
365 µm
14.4 mil
Unless otherwise specified, tolerances are
±13µm / ±0.5 mils. Chip thickness is 5.5 ± 0.5 mils.
Bond Pads are 41µm/1.6 mil typical on each side.
Note 1: Output contact is made by die attaching the
backside of the die.
OPTIONAL
OUTPUT [1]
For product information and a complete list of distributors, please go to our web site: www.avagotech.com
Avago, Avago Technologies, and the A logo are trademarks of Avago Technologies, Pte. in the United States and other countries.
Data subject to change. Copyright © 2006 Avago Technologies Pte. All rights reserved.
AV01-0023EN - November 1, 2007
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