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5962G9865202VYA View Datasheet(PDF) - Aeroflex UTMC

Part Name
Description
Manufacturer
5962G9865202VYA
UTMC
Aeroflex UTMC UTMC
5962G9865202VYA Datasheet PDF : 11 Pages
1 2 3 4 5 6 7 8 9 10
AC SWITCHING CHARACTERISTICS1, 2, 3
(VDD = +3.3V + 0.3V, TA = -55 °C to +125 °C)
SYMBOL
tPHLD 6
tPLHD 6
tSK
4
D
tSK 1 4
tSK 2 4
tTLH4
tTHL4
tPH
4
Z
tPLZ4
tPZH 4
tPZL4
PARAMETER
Differential Propagation Delay High to Low
CL = 10pf (figures 4 and 5)
Differential Propagation Delay Low to High
CL = 10pf (figures 4 and 5)
Differential Skew (tPHLD - tPLHD) (figures 4 and 5)
Channel-to-Channel Skew1 (figures 4 and 5)
Chip-to-Chip Skew5 (figures 4 and 5)
Rise Time (figures 4 and 5)
Fall Time (figures 4 and 5)
Disable Time High to Z (figures 6 and 7)
Disable Time Low to Z (figures 6 and 7)
Enable Time Z to High (figures 6 and 7)
Enable Time Z to Low (figures 6 and 7)
MIN
1.0
1.0
0
0
MAX
4.0
4.0
0.35
0.5
1.5
1.2
1.2
12
12
12
12
UNIT
ns
ns
ns
ns
ns
ns
ns
ns
ns
ns
ns
Notes:
1. Channel-to-Channel Skew is defined as the difference between the propagation delay of the channel and the other channels in t he same chip with an event on the inputs.
2. Generator waveform for all tests unless otherwise specified: f = 1 MHz, Z0 = 50, tr and t f (0% - 100%) < 1ns for RIN and tr and tf < 1ns for EN or EN.
3. CL includes probe and jig capacitance.
4. Guaranteed by characterization.
5. Chip to Chip Skew is defined as the difference between the minimum and maximum specified differential propagation delays.
6. May be tested at higher load capacitance and the limit interpolated from characterization data to guarantee this parameter.
6
 

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