5962H-9865104QYC View Datasheet(PDF) - Aeroflex UTMC
Part Name
Description
Manufacturer
5962H-9865104QYC Datasheet PDF : 14 Pages
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AC SWITCHING CHARACTERISTICS*1, 2, 3
(VDD = +3.3V + 0.3V, TC = -55 C to +125 C); Unless otherwise noted, Tc is per the temperature range ordered
SYMBOL
PARAMETER
MIN MAX MIN
MAX
UT54LVDS031LV UT54LVDS031LVE
tPHLD
Differential Propagation Delay High to Low
(figures 6 and 7)
0.3
3.0
0.8
1.5
tPLHD
Differential Propagation Delay Low to High
(figures 6 and 7)
0.3
3.0
0.8
1.5
tSKD
Differential Skew (tPHLD - tPLHD) (figures 6 and 7)
0
400
0
310
tSK1
Channel-to-Channel Skew1 (figures 6 and 7)
0
500
0
280
tSK2
Chip-to-Chip Skew5 (figure 6 and 7)
2.7
0.7
tTLH4
Rise Time (figures 6 and 7)
1.5
0.6
tTHL4
Fall Time (figures 6 and 7)
1.5
0.6
tPHZ
Disable Time High to Z (figures 8 and 9)
5.0
2.8
tPLZ
Disable Time Low to Z (figures 8 and 9)
5.0
2.8
tPZH
Enable Time Z to High (figures 8 and 9)
7.0
2.5
tPZL
Enable Time Z to Low (figures 8 and 9)
7.0
2.5
UNIT
ns
ns
ps
ps
ns
ns
ns
ns
ns
ns
ns
Notes:
* For devices procured with a total ionizing dose tolerance guarantee, the post-irradiation performance is guaranteed at 25oC per MIL-STD-883 Method 1019, Condition
A up to the maximum TID level procured.
1. Channel-to-Channel Skew is defined as the difference between the propagation delay of the channel and the other channels in the same chip with an event on the inputs.
2. Generator waveform for all tests unless otherwise specified: f = 1 MHz, ZO = 50, tr < 1ns, and tf < 1ns.
3. CL includes probe and jig capacitance.
4. Guaranteed by characterization
5. Chip to Chip Skew is defined as the difference between the minimum and maximum specified differential propagation delays.
36-00-06-004
Version 1.0.1
7
Cobham Semiconductor Solutions
www.aeroflex.com/LVDS
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