256Mb: x16, x32 2.5V VEXT, 1.8V VDD, 1.8V VDDQ, RLDRAM
Package Dimensions
Package Dimensions
Figure 32: 144-Ball µBGA
SEATING PLANE
0.08 A A
10.70 CTR
10º TYP
2.40 CTR
0.08 MAX
144X ∅ 0.45
DIMENSIONS APPLY
TO SOLDER BALLS
POST REFLOW. THE
PRE-REFLOW BALL
DIAMETER IS 0.50 ON
A 0.40 SMD BALL PAD.
8.80
BALL A12
0.80 TYP
BALL A1
BALL A1 ID
0.44 ±0.05
0.26 ±0.05
0.39 ±0.05
BALL A1 ID
17.00 15.40
8.50
1.00 TYP
18.50 ±0.10
9.25 ±0.05
17.90
CTR
4.40
5.50 ±0.05
11.00 ±0.10
Note: All dimensions in millimeters.
MOLD COMPOUND: EPOXY NOVOLAC
SUBSTRATE: PLASTIC LAMINATE
SOLDER BALL MATERIAL:
62% Sn, 36% Pb, 2%Ag OR
96.5% Sn, 3%Ag, 0.5% Cu
®
8000 S. Federal Way, P.O. Box 6, Boise, ID 83707-0006, Tel: 208-368-3900
prodmktg@micron.com www.micron.com Customer Comment Line: 800-932-4992
Micron, the M logo, and the Micron logo are trademarks of Micron Technology, Inc.
RLDRAM is a trademark of Infineon Technologies AG in various countries, and is used by Micron Technology, Inc. under
license from Infineon. All other trademarks are the property of their respective owners.
This data sheet contains minimum and maximum limits specified over the complete power supply and temperature range
for production devices. Although considered final, these specifications are subject to change, as further product
development and data characterization sometimes occur.
pdf: 09005aef81121545/source: 09005aef810c0ffc
256Mbx16x32RLDRAM_2.fm - Rev F 8/05 EN
38
Micron Technology, Inc., reserves the right to change products or specifications without notice.
©2001 Micron Technology, Inc. All rights reserved.