MT49H16M16(2002) View Datasheet(PDF) - Micron Technology

Part Name

Description

Manufacturer

MT49H16M16
(Rev.:2002)

REDUCED LATENCY DRAM (RLDRAM®)

Micron Technology 

0.850 ±0.075

SEATING PLANE

0.10 C

C

144X Ø .45 TYP

SOLDER BALL DIAMETER

REFERS TO POST REFLOW

CONDITION. THE

PRE-REFLOW DIAMETER

IS Ø 0.40

BALL A12

8.80

2.20 ±0.05

CTR

17.00

8.50 ±0.05

ADVANCE

256Mb: x16, x32

2.5V VEXT, 1.8V VDD, 1.8V VDDQ, RLDRAM

144-BALL T-FBGA

0.155 ±0.013

0.80

(TYP)

BALL A1

PIN A1 ID

9.25 ±0.05

18.50 ±0.10

CL

1.00

(TYP)

SOLDER BALL MATERIAL: EUTECTIC 63% Sn, 37% Pb or

62% Sn, 37% Pb, 2%Ag

SOLDER BALL PAD: Ø .33mm

SUBSTRATE: PLASTIC LAMINATE

MOLD COMPOUND: EPOXY NOVOLAC

PIN A1 ID

4.40 ±0.05 CL

5.50 ±0.05

11.00 ±0.10

NOTE: 1. All dimensions in millimeters.

1.20 MAX

DATA SHEET DESIGNATION

Advance: This data sheet contains initial descriptions of products still under development.

8000 S. Federal Way, P.O. Box 6, Boise, ID 83707-0006, Tel: 208-368-3900

E-mail: prodmktg@micron.com, Internet: http://www.micron.com, Customer Comment Line: 800-932-4992

Micron and the M logo are registered trademarks and the Micron logo is a trademark of Micron Technology, Inc.

256: x16, x32 RLDRAM

MT49H8M32_3.p65 – Rev. 3, Pub. 6/02

42

Micron Technology, Inc., reserves the right to change products or specifications without notice.

©2002, Micron Technology, Inc.

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