Approval sheet
General Purpose Capacitors
◙ Recommended soldering conditions
The lead-free termination MLCCs are not only to be used on SMT against lead-free solder paste, but also suitable
against lead-containing solder paste. If the optimized solder joint is requested, increasing soldering time, temperature and
concentration of N2 within oven are recommended.
4℃/ sec max
Fig. 6 Recommended IR reflow soldering profile for SMT process
with SnAgCu series solder paste.
Over 60sec at least by
natural cooling
Fig. 7 Recommended wave soldering profile for SMT process
with SnAgCu series solder.
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ASC_General Purpose_001M_DS-IBD
Apr. 2011