5962G9475403QYC View Datasheet(PDF) - Aeroflex UTMC

Part Name

Description

Manufacturer

5962G9475403QYC

Universal RADPAL™

Aeroflex UTMC 

UT22VP10 Radiation Hardened PAL

UT22VP10 * * * * *

Radiation:

- = None

Lead Finish:

(A) = Solder

(C) = Gold

(X) = Optional

Screening:

(C) = Military Temperature

(P) = Prototype

Package Type:

(P) = 24-pin DIP

(U) = 24-pin Flatpack

(W) = 28-pin Quad Flatpack

Device Type Modifier:

C-20 = CMOS I/O: 20ns propagation delay

C-25 = CMOS I/O: 25ns propagation delay

E-15 = CMOS I/O: 15.5ns propagation delay

E-20 = CMOS I/O: 20ns propagation delay

E-25 = CMOS I/O: 25ns propagation delay

T-15 = TTL I/O: 15.5ns propagation delay

T-20 = TTL I/O: 20ns propagation delay

T-25 = TTL I/O: 25ns propagation delay

Notes:

1. Lead finish (A, C, or X) must be specified.

2. If an “X” is specified when ordering, part marking will match the lead finish and will be either “A” (solder) or “C” (gold).

3. Military Temperature range flow per UTMC’s manufacturing flows document. Devices have 48 hours of burn-in and are tested at -55°C,

room temperature, and 125°C. Radiation characteristics are neither tested nor guaranteed and may not be specified.

4. Prototype flow per UTMC Manufacturing Flows Technical Description. Devices have prototype assembly and are tested at 25°C only.

Radiation is neither tested nor guaranteed.

5. (T-15, C-25, T-25, C-20, T-20) is VDD(min) = -0.009*(oC)+4.61.

6. (E-15, E-20 and E-25) is VDD(min) = -0.009*(oC)+4.41.

7. (E-15 and T-15) is tested at at -55°C, +25°C, and +50°C to 15.5ns for tPD. At +125°C tested to 20ns limit for tPD.

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