μ PC79Mxx Series
<R> RECOMMENDED SOLDERING CONDITIONS
The μ PC79Mxx Series should be soldered and mounted under the following recommended conditions.
For soldering methods and conditions other than those recommended below, contact an NEC Electronics sales
representative.
For technical information, see the following website.
Semiconductor Device Mount Manual (http://www.necel.com/pkg/en/mount/index.html)
Through-hole devices
μ PC79M05HF, 79M08HF, 79M12HF, 79M15HF, 79M18HF, 79M24HF,
μ PC79M05HF-AZ, 79M08HF-AZ, 79M12HF-AZ, 79M15HF-AZ, 79M18HF-AZ, 79M24HF-AZ : 3-PIN PLASTIC SIP (MP-45G)
(Isolated TO-220 )
Process
Conditions
Symbol
Wave soldering
Solder temperature: 260°C or below, Flow time: 10 seconds or less, WS60-00-1
(only to leads)
Maximum number of flow processes: 1 time.
Partial heating method
Pin temperature: 350°C or below,
P350
Heat time: 3 seconds or less (Per each pin).
Caution For through-hole device, the wave soldering process must be applied only to leads, and make sure that
the package body does not get jet soldered.
<R> REFERENCE DOCUMENTS
Document Name
Usage of Three-Terminal Regulators User’s Manual
Semiconductor Device Mount Manual
Review of Quality and Reliability Handbook Information
Document No.
G12702E
http://www.necel.com/pkg/en/mount/index.html
C12769E
10
Data Sheet G11629EJ7V0DS