5962-89570 View Datasheet(PDF) - Avago Technologies

Part Name

Description

Manufacturer

5962-89570

Hermetically Sealed, Very High Speed, Logic Gate Optocouplers

Avago Technologies 

Leaded Device Marking

Avago LOGO

Avago P/N

DLA SMD*

DLA SMD*

PIN ONE/

ESD IDENT

Avago QYYWWZ

XXXXXX

XXXXXXX

XXX USA

* 50434

* QUALIFIED PARTS ONLY

COMPLIANCE INDICATOR,*

DATE CODE, SUFFIX (IF NEEDED)

COUNTRY OF MFR.

Avago FSCN*

Leadless Device Marking

Avago LOGO

Avago P/N

PIN ONE/

ESD IDENT

COUNTRY OF MFR.

Avago QYYWWZ

XXXXXX

* XXXX

XXXXXX

USA 50434

COMPLIANCE INDICATOR,*

DATE CODE, SUFFIX (IF NEEDED)

DLA SMD*

DLA SMD*

Avago FSCN*

* QUALIFIED PARTS ONLY

Hermetic Optocoupler Options

Option

100

Description

Surface mountable hermetic optocoupler with leads trimmed for butt joint assembly. This option is available on

commercial and hi-rel product in 8 pin DIP (see drawings below for details).

4.32 (0.170)

MAX.

0.51 (0.020)

MIN.

2.29 (0.090)

2.79 (0.110)

1.14 (0.045)

1.40 (0.055)

0.51 (0.020)

MAX.

Note: Dimensions in millimeters (inches).

0.20 (0.008)

0.33 (0.013)

7.36 (0.290)

7.87 (0.310)

200

Lead finish is solder dipped rather than gold plated. This option is available on commercial and hi-rel product in

8 pin DIP. DLA Drawing part numbers contain provisions for leadfinish. All leadless chip carrier devices are

delivered with solder dipped terminals as a standard feature.

300

Surface mountable hermetic optocoupler with leads cut and bent for gull wing assembly. This option is

available on commercial and hi-rel product in 8 pin DIP (see drawings below for details). This option has

solder dipped leads.

4.57 (0.180)

MAX.

0.51 (0.020)

MIN.

2.29 (0.090)

2.79 (0.110)

1.40 (0.055)

1.65 (0.065)

0.51 (0.020)

MAX.

5° MAX.

Note: Dimensions in millimeters (inches).

*Solder contains lead.

0.20 (0.008)

0.33 (0.013)

9.65 (0.380)

9.91 (0.390)

4.57 (0.180)

MAX.

1.07 (0.042)

1.32 (0.052)

4

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