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BUK108-50DL View Datasheet(PDF) - NXP Semiconductors.

Part Name
Description
Manufacturer
BUK108-50DL
NXP
NXP Semiconductors. NXP
BUK108-50DL Datasheet PDF : 10 Pages
1 2 3 4 5 6 7 8 9 10
Philips Semiconductors
PowerMOS transistor
Logic level TOPFET
Product specification
BUK108-50DL
IISL & IIS / uA
600
BUK108-50DL
500
PROTECTION LATCHED
400
IISL
300
RESET
IIS
200
100
NORMAL
0
0
2
4
6
VIS / V
Fig.14. Typical DC input characteristics, Tj = 25 ˚C.
IISL & IIS = f(VIS); protection latched & normal operation
IS / A
60
BUK108-50DL
50
40
30
20
10
0
0
0.2
0.4
0.6
0.8
1
1.2 1.4
VSD / V
Fig.15. Typical reverse diode current, Tj = 25 ˚C.
IS = f(VSDS); conditions: VIS = 0 V; tp = 250 µs
VDD
RL
D
TOPFET
I
P
D.U.T.
RI
VIS
S
ID measure
0V
0R1
Fig.16. Test circuit for resistive load switching times.
VIS / V & VDS / V
VDS
10
VIS
5
BUK108-50DL
0
0
100
200
300
400
time / us
Fig.17. Typical switching waveforms, resistive load.
VDD = 13 V; RL = 4 ; RI = 50 , Tj = 25 ˚C.
EDSM%
120
110
100
90
80
70
60
50
40
30
20
10
0
0
20
40
60
80 100 120 140
Tmb / C
Fig.18. Normalised limiting clamping energy.
EDSM% = f(Tmb); conditions: ID = 15 A; VIS = 5 V
VDS
0
ID
0
VIS
0
V(CL)DSS
VDD
L
+ VDD
VDS
D
TOPFET
I
P
D.U.T.
-
-ID/100
RIS
Schottky
S
R 01
shunt
Fig.19. Clamping energy test circuit, RIS = 50 .
EDSM = 0.5 L ID2 V(CL)DSS/(V(CL)DSS VDD)
June 1996
7
Rev 1.000
 

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