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ADG802BRT View Datasheet(PDF) - Analog Devices

Part Name
Description
Manufacturer
ADG802BRT Datasheet PDF : 9 Pages
1 2 3 4 5 6 7 8 9
PRELIMINARY TECHNICAL DATA
ADG801/ADG802
ABSOLUTE MAXIMUM RATINGS1
(TA = +25°C unless otherwise noted)
VDD to GND . . . . . . . . . . . . . . . . . . . . . . . . . . . 0.3 V to +7 V
Analog Inputs2 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . - 0.3 V to VDD +0.3 V
. . . . . . . . . . . . . . . . . . . . or 30 mA, Whichever Occurs First
Continuous Current, S or D . . . . . . . . . . . . . . . . . . . . 400 mA
Peak Current, S or D . . . . . . . . . . . . . . . . . . . . . . . . . 800 mA
(Pulsed at 1 ms, 10% Duty Cycle Max)
Operating Temperature Range
Extended . . . . . . . . . . . . . . . . . . . . . . . 40°C to +125°C
Storage Temperature Range . . . . . . . . . 65°C to +150°C
Junction Temperature . . . . . . . . . . . . . . . . . . . . . . . . +150°C
µSOIC Package, Power Dissipation . . . . . . . . . . . 315 mW
θJA Thermal Impedance . . . . . . . . . . . . . . . . . . 206°C/W
θJC Thermal Impedance . . . . . . . . . . . . . . . . . . . 44°C/W
SOT-23 Package, Power Dissipation . . . . . . . . . . 282 mW
θJA Thermal Impedance . . . . . . . . . . . . . . . . . 229.6°C/W
θJC Thermal Impedance . . . . . . . . . . . . . . . . . 91.99°C/W
Lead Temperature, Soldering (10seconds) . . . . . . . 300°C
IR Reflow, Peak Temperature . . . . . . . . . . . . . . . . . +220°C
ESD.....................................................................2kV
NOTES
1Stresses above those listed under Absolute Maximum Ratings may
cause permanent damage to the device. This is a stress rating only;
functional operation of the device at these or any other conditions above
those listed in the operational sections of this specification is not implied.
Exposure to absolute maximum rating conditions for extended periods
may affect device reliability. Only one absolute maximum rating may
be applied at any one time.
2Overvoltages at IN, S or D will be clamped by internal diodes. Current should be
limited to the maximum ratings given.
Table I. Truth Table
ADG801 In
0
1
ADG802 In
1
0
Switch Condition
OFF
ON
PIN CONFIGURATIONS
6-Lead Plastic Surface Mount (SOT-23)
(RT-6)
D1
6 VDD
ADG801/
S 2 ADG802 5 NC
GND 3 TOP VIEW 4 IN
(Not to Scale)
NC = NO CONNECT
8-Lead Small Outline µSOIC
(RM-8)
D1
NC 2
NC 3
VDD 4
8
ADG801/ 7
ADG802
TOP VIEW 6
(Not to Scale)
5
S
GND
IN
NC
NC = NO CONNECT
ORDERING GUIDE
Model
Temperature Range Supply Option1 Brand1 Package Descriptions
Package Options
ADG801BRT
ADG801BRM
ADG802BRT
ADG802BRM
40°C to +125°C
40°C to +125°C
40°C to +125°C
40°C to +125°C
3 V, 5 V
3 V, 5 V
3 V, 5 V
3 V, 5 V
SLB
SLB
SMB
SMB
SOT-23 (Plastic Surface Mount) RT-6
µSOIC (Small Outline)
RM-8
SOT-23 (Plastic Surface Mount) RT-6
µSOIC (Small Outline)
RM-8
1Branding on SOT-23 and µSOIC packages is limited to 3 characters due to space constraints.
CAUTION
ESD (electrostatic discharge) sensitive device. Electrostatic charges as high as 4000 V readily
accumulate on the human body and test equipment and can discharge without detection. Although
the ADG801/ADG802 features proprietary ESD protection circuitry, permanent damage may
occur on devices subjected to high energy electrostatic discharges. Therefore, proper ESD
precautions are recommended to avoid performance degradation or loss of functionality.
–4–
WARNING!
ESD SENSITIVE DEVICE
REV. PrE
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