QL6325-5PT280I View Datasheet(PDF) - QuickLogic Corporation
Part Name
Description
Manufacturer
QL6325-5PT280I Datasheet PDF : 73 Pages
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Eclipse Family Data Sheet Rev. F
Package Thermal Characteristics
Thermal Resistance Equations:
θJC = (TJ - TC)/P
θJA = (TJ - TA)/P
PMAX = (TJMAX - TAMAX)/ θJA
Parameter Description:
θJC: Junction-to-case thermal resistance
θJA: Junction-to-ambient thermal resistance
TJ: Junction temperature
TA: Ambient temperature
P: Power dissipated by the device while operating
PMAX: The maximum power dissipation for the device
TJMAX: Maximum junction temperature
TAMAX: Maximum ambient temperature
NOTE: Maximum junction temperature (TJMAX) is 150°C. To calculate the maximum power dissipation
for a device package look up θJA from Table 22, pick an appropriate TAMAX and use:
PMAX = (150ºC - TAMAX)/ θJA
Table 22: Package Thermal Characteristics
Package Description
Pin
Count
Package
Type
θJA (º C/W) @ various flow rates (m/sec) θJC (º C/W)
0
0.5
1
2
516
PBGA
20.0
19.0
17.5
16.0
7.0
484
PBGA
28.0
26.0
25.0
23.0
9.0
280
LFBGA
18.5
17.0
15.5
14.0
7.0
208
PQFP
26.0
24.5
23.0
22.0
11.0
© 2007 QuickLogic Corporation
www.quicklogic.com
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