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DAC8408GP View Datasheet(PDF) - Analog Devices

Part Name
Description
Manufacturer
DAC8408GP Datasheet PDF : 16 Pages
1 2 3 4 5 6 7 8 9 10 Next Last
DAC8408
ELECTRICAL CHARACTERISTICS @ VDD = +5 V; VREF = ؎10 V; VOUTA, B, C, D = 0 V; TA = –55؇C to +125؇C apply for
DAC8408AT/BT, TA = –40؇C to +85؇C apply for DAC8408ET/FT/FP/FPC/FS; TA = 0؇C to +70؇C apply for DAC8408GP, unless otherwise noted.
Specifications apply for DAC A, B, C, & D. Continued
Parameter
Symbol Conditions
DAC8408
Min Typ Max Units
POWER SUPPLY
Voltage Range
Supply Current8
Supply Current9
VDD
4.5
IDD
IDD
TA = +25°C
TA = Full Temperature Range
5.5
V
50
µA
1.0
mA
1.5
mA
NOTES
1This is an end-point linearity specification.
2Guaranteed to be monotonic over the full operating temperature range.
3ppm/°C of FSR (FSR = Full Scale Range = VREF-1 LSB.)
4Input Resistance Temperature Coefficient = +300ppm/°C.
5Logic Inputs are MOS gates. Typical input current at +25°C Is less than 10 nA.
6Guaranteed by design.
7From Digital Input to 90% of final analog output current.
8All Digital Inputs “0” or VDD.
9All Digital Inputs VIH or VIL.
10See Timing Diagram.
11Digital Inputs = 0 V to VDD or VDD to 0 V.
12Extrapolated: tS (1/2 LSB) = tPD + 6.2τ where τ = the measured first time con-
stant of the final RC decay.
13All Digital Inputs = 0 V; VREF = +10 V.
Specifications subject to change without notice.
PIN CONNECTIONS
DAC8408
TOP VIEW
(Not to Scale)
ABSOLUTE MAXIMUM RATINGS
(TA = +25°C, unless otherwise noted.)
VDD to IOUT 2A, IOUT 2B, IOUT 2C, IOUT 2D . . . . . . . . . . 0 V, +7 V
VDD to DGND . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 0 V, +7 V
IOUT 1A, IOUT 1B,
IOUT 1C, IOUT 1D to DGND . . . . . . . . . –0.3 V to VDD +0.3 V
RFBA, RFBB, RFBC, RFBD to IOUT . . . . . . . . . . . . . . . . . ± 25 V
IOUT 2A, IOUT 2B,
IOUT 2C, IOUT 2D to DGND . . . . . . . . . –0.3 V to VDD + 0.3 V
DB0 through DB7 to DGND . . . . . . . . –0.3 V to VDD + 0.3 V
Control Logic
Input Voltage to DGND . . . . . . . . . . –0.3 V + VDD + 0.3 V
VREFA, VREFB, VREFC, VREFD to
IOUT 2A, IOUT 2B, IOUT 2C, IOUT 2D . . . . . . . . . . . . . . . . ± 25 V
Operating Temperature Range
Commercial Grade (GP) . . . . . . . . . . . . . . . . 0°C to +70°C
Industrial Grade (ET, FT, FP, FPC, FS) . –40°C to +85°C
Military Grade (AT, BT) . . . . . . . . . . . . . . –55°C to +125°C
Junction Temperature . . . . . . . . . . . . . . . . . . . . . . . . . +150°C
Storage Temperature . . . . . . . . . . . . . . . . . . . –65°C to +150°C
Lead Temperature (Soldering, 10 sec) . . . . . . . . . . . . . +300°C
Package Type
JA*
JC
Units
28-Pin Hermetic DIP (T)
55
10
°C/W
28-Pin Plastic DIP (P)
53
27
°C/W
28-Pin SOL (S)
68
23
°C/W
28-Contact PLCC (PC)
66
29
°C/W
*θJA is specified for worst case mounting conditions, i.e., θJA is specified for
device in socket for cerdip and P-DIP packages; θJA is specified for device
soldered to printed circuit board for SOL and PLCC packages.
CAUTION
1. Do not apply voltages higher than VDD +0.3 V or less than
–0.3 V potential on any terminal except VREF and RFB.
2. The digital control inputs are diode-protected; however,
permanent damage may occur on unconnected inputs from
high energy electrostatic fields. Keep in conductive foam at
all times until ready to use.
3. Use proper antistatic handling procedures.
4. Absolute Maximum Ratings apply to both packaged devices
and DICE. Stresses above those listed under Absolute Maxi-
mum Ratings may cause permanent damage to the device.
REV. A
–3–
 

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