MCP1702 View Datasheet(PDF) - Microchip Technology

Part Name

Description

Manufacturer

MCP1702

250 mA Low Quiescent Current LDO Regulator

Microchip Technology 

MCP1702

TEMPERATURE SPECIFICATIONS (Note 1)

Parameters

Sym

Min

Typ

Max Units

Conditions

Temperature Ranges

Operating Junction Temperature Range

TJ

-40

Maximum Junction Temperature

TJ

—

Storage Temperature Range

TA

-65

Thermal Package Resistance (Note 2)

+125

+150

+150

°C Steady State

°C Transient

°C

Thermal Resistance, 3L-SOT-23A

JA

—

336

—

°C/W

EIA/JEDEC JESD51-7

FR-4 0.063 4-Layer Board

Thermal Resistance, 3L-SOT-89

JC

—

110

— °C/W

JA

—

153.3

—

°C/W

EIA/JEDEC JESD51-7

FR-4 0.063 4-Layer Board

JC

—

100

— °C/W

Thermal Resistance, 3L-TO-92

JA

—

131.9

—

°C/W

JC

—

66.3

— °C/W

Note 1: The maximum allowable power dissipation is a function of ambient temperature, the maximum allowable junction

temperature and the thermal resistance from junction to air (i.e., TA, TJ, JA). Exceeding the maximum allowable power

dissipation will cause the device operating junction temperature to exceed the maximum 150°C rating. Sustained

junction temperatures above 150°C can impact the device reliability.

2: Thermal Resistance values are subject to change. Please visit the Microchip web site for the latest packaging

information.

 2010 Microchip Technology Inc.

DS22008E-page 5

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