MAD1109E3 View Datasheet(PDF) - Microsemi Corporation
Part Name
Description
Manufacturer
MAD1109E3 Datasheet PDF : 2 Pages
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SCOTTSDALE DIVISION
MAD1109 and MAD1109e3
Switching Diode Array
Steering Diode TVS Array™
DESCRIPTION
APPEARANCE
These low capacitance diode arrays are multiple, discrete, isolated
junctions fabricated by a planar process and mounted in a 14-PIN package
for use as steering diodes protecting up to seven I/O ports from ESD, EFT,
or surge by directing them either to the positive side of the power supply
line or to ground (see figure 1). An external TVS diode may be added
between the positive supply line and ground to prevent overvoltage on the
supply rail. They may also be used in fast switching core-driver
applications. This includes computers and peripheral equipment such as
magnetic cores, thin-film memories, plated-wire memories, etc., as well as
decoding or encoding applications. These arrays offer many advantages of
integrated circuits such as high-density packaging and improved reliability.
This is a result of fewer pick and place operations, smaller footprint, smaller
weight, and elimination of various discrete packages that may not be as
user friendly in PC board mounting. They are available with either Tin-Lead
plating termination or as RoHS Compliant with annealed matte-Tin finish by
adding an e”3” suffix to the part number.
IMPORTANT: For the most current data, consult MICROSEMI’s website: http://www.microsemi.com
Top Viewing Pin Layout
FEATURES
• 7 Diode Array / protects 7 lines
• Molded 14-Pin Dual-In-Line Package
• UL 94V-0 Flammability Classification
• Low Capacitance 1.5 pF per diode
• Switching speeds less than 5 ns
• RoHS Compliant devices available by adding “e3” suffix
• IEC 61000-4 compatible
61000-4-2 (ESD): Air 15kV, contact – 8 kV
61000-4-4 (EFT): 40A – 5/50 ns
61000-4-5 (surge): 12A, 8/20 µs
APPLICATIONS / BENEFITS
• Low capacitance steering diode protection for high
frequency data lines
• RS-232 & RS-422 Interface Networks
• Ethernet: 10 Base T
• Computer I / O Ports
• LAN
• Switching Core Drivers
MAXIMUM RATINGS
• Operating Temperature: -55°C to +150°C
• Storage Temperature: -55°C to +150°C
• Forward Surge Current: 2 Amps (8.3 ms)
12 Amps (8/20 µs)
• Continuous Forward Current: 400 mA (one diode)
• Power Dissipation (PD): 1500 mW (total)
• Solder temperatures: 260°C for 10 s (maximum)
MECHANICAL AND PACKAGING
• CASE: Void-free transfer molded thermosetting
epoxy body meeting UL94V-0 flammability
classification
• TERMINALS: Tin-Lead or RoHS Compliant
annealed matte-Tin plating solderable per MIL-STD-
750 method 2026
• MARKING: MSC logo, MAD1109 or MAD1109e3 and
date code. Pin #1 is to the left of the dot or indent on
top of package.
• WEIGHT: 0.997 grams (approximate)
• Carrier tubes: 25 pcs (Standard)
ELECTRICAL CHARACTERISTICS PER LINE @ 25°C Unless otherwise specified
PART
NUMBER
BREAKDOWN
VOLTAGE
VBR
@ IBR =100µA
V
WORKING
PEAK
REVERSE
VOLTAGE
VRWM
V
LEAKAGE
CURRENT
IR
TA = 25°C
µA
LEAKAGE
CURRENT
IR
TA = 150°C
µA
CAPACITANCE
C
@0V
pF
REVERSE
RECOVERY
TIME
trr
ns
FORWARD
VOLTAGE
VF
IF = 10 mA
V
FORWARD
VOLTAGE
VF
IF = 100 mA
V
MIN
MAX
MAX
@VR
MAX
@VR
TYP
MAX
MAX
MAX
MAD1109
MAD1109e3
90
75
0.200
20
300
20
1.5
5.0
1.00
1.20
Copyright © 2005
6-28-2005 REV L
Microsemi
Scottsdale Division
8700 E. Thomas Rd. PO Box 1390, Scottsdale, AZ 85252 USA, (480) 941-6300, Fax: (480) 947-1503
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