Electronic component search and free download site.
Transistors,MosFET ,Diode,Integrated circuits

5962F9568902QXC View Datasheet(PDF) - Intersil

Part Name
Description
Manufacturer
5962F9568902QXC Datasheet PDF : 3 Pages
1 2 3
HS-26CLV32RH, HS-26CLV32EH
Die Characteristics
DIE DIMENSIONS:
78 mils x 123 mils x 21 mils
(1970µm x 3120µm)
INTERFACE MATERIALS:
Glassivation:
Type: PSG (Phosphorus Silicon Glass)
Thickness: 8kÅ ±1kÅ
Substrate:
AVLSI1RA, Silicon backside, VDD backside potential
Metallization Mask Layout
HS-26CLV32RH, HS-26CLV32EH
AIN
VDD
BIN
(1)
(16)
(15)
AIN (2)
AOUT (3)
ENAB (4)
COUT (5)
CIN (6)
Metallization:
Bottom: Mo/TiW
Thickness: 5800Å ±1kÅ
Top: Al/Si/Cu
Thickness: 10kÅ ±1kÅ
Worst Case Current Density:
<2.0 x 105A/cm2
Bond Pad Size:
110µm x 100µm
TABLE 1. HS-26CLV32RH, HS-26CLV32EH PAD COORDINATES
PIN
NUMBER
PAD
NAME
RELATIVE TO PIN 1
X COORDINATES Y COORDINATES
1
AIN
0
0
2
(14) BIN
3
4
AIN
AOUT
ENABLE
-337.1
-337.1
-337.1
-362
-912.5
-1319.3
5
6
(13) BOUT
7
COUT
CIN
CIN
-337.1
-337.1
0
-1774.4
-2233.7
-2595.7
8
GND
418.4
-2596.7
9
DIN
776.4
-2595.7
(12) ENAB
10
DIN
1113.5
-2233.7
11
DOUT
12
ENABLE
1113.5
1113.5
-1774.4
-1319.3
13
(11) DOUT
14
BOUT
BIN
1113.5
1113.5
-898.4
-362
15
BIN
776.4
0
16
VDD
420.2
1
(10) DIN NOTE: Dimensions in microns
(7)
(8)
(9)
CIN
GND
DIN
For additional products, see www.intersil.com/product_tree
Intersil products are manufactured, assembled and tested utilizing ISO9000 quality systems as noted
in the quality certifications found at www.intersil.com/design/quality
Intersil products are sold by description only. Intersil Corporation reserves the right to make changes in circuit design, software and/or specifications at any time
without notice. Accordingly, the reader is cautioned to verify that data sheets are current before placing orders. Information furnished by Intersil is believed to be
accurate and reliable. However, no responsibility is assumed by Intersil or its subsidiaries for its use; nor for any infringements of patents or other rights of third
parties which may result from its use. No license is granted by implication or otherwise under any patent or patent rights of Intersil or its subsidiaries.
For information regarding Intersil Corporation and its products, see www.intersil.com
3
FN4907.4
January 8, 2013
Direct download click here

 

Share Link: 

datasheetq.com  [ Privacy Policy ]Request Datasheet ] [ Contact Us ]