7.3 15CC1
123 4
A
Pin#1 ID
B
D
C
D
E
TOP VIEW
0.08
SIDE VIEW
b1
A1
A
A2
E1
e
15-Øb
D
e
C
D1
COMMON DIMENSIONS
(Unit of Measure = mm)
B
SYMBOL MIN NOM MAX NOTE
A
–
–
0.60
A
A1
0.12
–
–
A1 BALL CORNER
123 4
A2
0.38 REF
b
0.25 0.30 0.35 1
BOTTOM VIEW
b1
0.25
–
–
2
D
2.90 3.00 3.10
D1
1.95 BSC
E
2.90 3.00 3.10
Note1: Dimension “b” is measured at the maximum ball dia. in a plane parallel
E1
to the seating plane.
e
Note2: Dimension “b1” is the solderable surface defined by the opening of the
solder resist layer.
Package Drawing Contact:
R packagedrawings@atmel.com
TITLE
15CC1, 15-ball (4 x 4 Array), 3.0 x 3.0 x 0.6 mm
package, ball pitch 0.65 mm,
Ultra thin, Fine-Pitch Ball Grid Array Package (UFBGA)
1.95 BSC
0.65 BSC
GPC
07/06/10
DRAWING NO. REV.
CBC
15CC1
C
16 ATtiny24A/44A/84A
8183FS–AVR–06/12