ACPM-5208 View Datasheet(PDF) - Avago Technologies
Part Name
Description
Manufacturer
ACPM-5208 Datasheet PDF : 13 Pages
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Reflow Profile Recommendations
Tp
TL
Tsmax
Tsmin
ts
Preheat
tp
Ramp-up
tL
Critical Zone
TL to Tp
Ramp-down
25
t 25°C to Peak
Time
Typical SMT Reflow Profile for Maximum Temperature = 260 +0/-5°C
Typical SMT Reflow Profile for Maximum Temperature = 260 +0/-5°C
Profile Feature
Average ramp-up rate (TL to TP)
Preheat
– Temperature Min (Tsmin)
– Temperature Max (Tsmax)
– Time (min to max) (ts)
Tsmax to TL
– Ramp-up Rate
Time maintained above:
– Temperature (TL)
– Time (TL)
Peak temperature (Tp)
Time within 5°C of actual Peak Temperature (tp)
Ramp-down Rate
Time 25°C to Peak Temperature
Sn-Pb Solder
3°C/sec max
100°C
150°C
60-120 sec
183°C
60-150 sec
240 +0/-5°C
10-30 sec
6°C/sec max
6 min max.
Pb-Free Solder
3°C/sec max
150°C
200°C
60-120 sec
3°C/sec max
217°C
60-150 sec
260 +0/-5°C
20-40 sec
6°C/sec max
8 min max.
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