5962F9763901VXC View Datasheet(PDF) - Intersil

Part Name

Description

Manufacturer

5962F9763901VXC

Radiation Hardened Dual 2-to-4 Line Decoder/Demultiplexer

Intersil 

ACS139MS

Die Characteristics

DIE DIMENSIONS:

Size: 2390µm x 2390µm (94 mils x 94 mils)

Thickness: 525µm ±25µm (20.6 mils ±1 mil)

Bond Pad: 110µm x 110µm (4.3 mils x 4.3 mils)

METALLIZATION:

Type: Al

Metal 1 Thickness: 0.7µm ±0.1µm

Metal 2 Thickness: 1.0µm ±0.1µm

SUBSTRATE:

Silicon on Sapphire (SOS)

Metallization Mask Layout

1A 0

SUBSTRATE POTENTIAL:

Unbiased Insulator

BACKSIDE FINISH:

Sapphire

PASSIVATION

Type: Phosphorous Silicon Glass (PSG)

Thickness: 1.30µm ±0.15µm

SPECIAL INSTRUCTIONS:

Bond VCC First

ADDITIONAL INFORMATION:

Worst Case Density: <2.0 x 105 A/cm2

Transistor Count: 190

ACS139MS.

1E

VCC

2E

1A1

2A0

1Y0

2A1

1Y1

2Y0

1Y2

2Y1

1Y3 GND

2Y3

2Y2

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notice. Accordingly, the reader is cautioned to verify that data sheets are current before placing orders. Information furnished by Intersil is believed to be accurate

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