5962F9800801VXC View Datasheet(PDF) - Intersil
Part Name
Description
Manufacturer
5962F9800801VXC Datasheet PDF : 2 Pages
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ACS257MS
Die Characteristics
DIE DIMENSIONS:
Size: 2390µm x 2390µm (94 mils x 94 mils)
Thickness: 525µm ±25µm (20.6 mils ±1 mil)
Bond Pad: 110µm x 110µm (4.3 x 4.3 mils)
METALLIZATION: Al
Metal 1 Thickness: 0.7µm ±0.1µm
Metal 2 Thickness: 1.0µm ±0.1µm
SUBSTRATE POTENTIAL:
Unbiased Insulator
PASSIVATION
Type: Phosphorous Silicon Glass (PSG)
Thickness: 1.30µm ±0.15µm
SPECIAL INSTRUCTIONS:
Bond VCC First
ADDITIONAL INFORMATION:
Worst Case Density: <2.0 x 105 A/cm2
Transistor Count: 212
Metallization Mask Layout
ACS257MS
1I0
S
VCC
OE
1I1
4I 0
1Y
4I 1
2I 0
4Y
2I 1
3I 0
2Y
GND
3Y
3I 1
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