Freescale Semiconductor, Inc.
PACKAGE INFORMATION
Soldering Information
The 33888 is packaged in a surface mount power package
intended to be soldered directly onto the printed circuit board.
The device was qualified in accordance with JEDEC
standards JESD22-A113-B and J-STD-020A. The
recommended reflow conditions are as follows:
• Convection: 225°C +5.0°C/-0°C
• Vapor Phase Reflow (VPR): 215°C to 219°C
• Infrared (IR)/Convection: 225°C +5.0°C/-0°C
The maximum peak temperature during the soldering
process should not exceed 230°C. The time at maximum
temperature should range from 10 seconds to 40 seconds
maximum.
APPLICATIONS
Typical Application
Figure 9 shows a typical application for the 33888.
VPWR
+5.0 V
10 kΩ
4
MCU
4
A/D
A/D
RC1
RC2
+5.0 V
8 x Relay or LED
V33DD888
FS VDD
VPWR
IHS0 : IHS3
ILS
8 x 0.5 Ω
RST
SPI
40 mΩ
WDIN
40 mΩ
CSNS2 - 3
CSNS0 - 1
FSI
GND
10 mΩ
10 mΩ
65 W
65 W
Loads
21 W 5.0 W
21 W 5.0 W
Figure 9. 33888 Typical Application Diagram
MOTOROLA ANALOG INTEGRATED CIRCUIT DEVICE DATA
For More Information On This Product,
Go to: www.freescale.com
33888
27