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MSA-0300-GP4 View Datasheet(PDF) - HP => Agilent Technologies

Part Name
Description
Manufacturer
MSA-0300-GP4
HP
HP => Agilent Technologies HP
MSA-0300-GP4 Datasheet PDF : 4 Pages
1 2 3 4
MSA-0300 Absolute Maximum Ratings
Parameter
Absolute Maximum[1]
Device Current
80 mA
Power Dissipation[2,3]
425 mW
RF Input Power
Junction Temperature
Storage Temperature
+13 dBm
200°C
–65 to 200°C
Notes:
1. Permanent damage may occur if any of these limits are exceeded.
2. TMounting Surface (TMS) = 25°C.
3. Derate at 22.2 mW/°C for TC > 181°C.
4. The small spot size of this technique results in a higher, though more
accurate determination of θjc than do alternate methods. See MEASURE-
MENTS section “Thermal Resistance” for more information.
Thermal Resistance[2,4]:
θjc = 45°C/W
Electrical Specifications[1], TA = 25°C
Symbol
Parameters and Test Conditions[2]: Id = 35 mA, ZO = 50
GP
Power Gain (|S21| 2)
GP
Gain Flatness
f = 0.1 GHz
f = 0.1 to 1.8 GHz
f3 dB
3 dB Bandwidth
VSWR
Input VSWR
Output VSWR
f = 0.1 to 3.0 GHz
f = 0.1 to 3.0 GHz
NF
50 Noise Figure
f = 1.0 GHz
P1 dB Output Power at 1 dB Gain Compression
f = 1.0 GHz
IP3
Third Order Intercept Point
f = 1.0 GHz
tD
Group Delay
f = 1.0 GHz
Vd
Device Voltage
dV/dT Device Voltage Temperature Coefficient
Units Min.
dB
dB
GHz
dB
dBm
dBm
psec
V
4.5
mV/°C
Typ. Max.
12.5
± 0.6
2.8
1.8:1
1.8:1
6.0
10.0
23.0
125
5.0 5.5
–8.0
Notes:
1. The recommended operating current range for this device is 20 to 50 mA. Typical performance as a function of current
is on the following page.
2. RF performance of the chip is determined by packaging and testing 10 devices per wafer in a dual ground configuration.
Part Number Ordering Information
Part Number
Devices Per Tray
MSA-0300-GP4
100
6-291
 

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