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ACS704ELC-015 View Datasheet(PDF) - Allegro MicroSystems

Part Name
Description
Manufacturer
ACS704ELC-015 Datasheet PDF : 20 Pages
First Prev 11 12 13 14 15 16 17 18 19 20
ACS704ELC-015
The Effect of PCB Layout on ACS704 Electrical Performance
Eight different PC boards were fabricated to characterize the effect of PCB design on the operating junction temperature of the
Hall-effect IC inside of the ACS704. These PC boards are shown in the figure below.
2 oz. Cu on one side of board
2 oz. Cu on both sides of board
An ACS704 device was soldered onto each PC board before beginning the thermal testing. Thermal management tests
were conducted with the following test conditions:
Tests were conducted at ambient temperature, Ta = 20°C. All tests were conducted in still air.
14 gauge wires were used to connect a power supply to a single PC board. These wires carry the 15 A dc primary current during
the tests.
A 15 A dc primary current was applied to a single PC board containing an ACS704 device. This current flowed from pins 1 and 2
to pins 3 and 4 of the ACS704 package.
A 1 mA current was forced from the GND pin to the VCC pin by a Fluke 179 True RMS Multimeter. This was the only power
applied to pins 5-8 of the ACS704 package during testing.
The voltage required to force the 1 mA current from the GND pin to the VCC pin was measured after applying the 15 A primary
current for approximately 25 minutes. A graph similar to the graph below was used to determine the junction temperature of the
ACS704.
Voltage vs. Temperature Curve used to Determine Die Junction Temperature
ACS704ELC015-DS, Rev. 6
17
115 Northeast Cutoff, Box 15036
Worcester, Massachusetts 01615-0036 (508) 853-5000
www.allegromicro.com
 

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