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59628864405VXX View Datasheet(PDF) - Aeroflex UTMC

Part Name
Description
Manufacturer
59628864405VXX
UTMC
Aeroflex UTMC UTMC
59628864405VXX Datasheet PDF : 23 Pages
First Prev 11 12 13 14 15 16 17 18 19 20 Next Last
D
1.00+- .025
LEAD 1 INDICATOR
b
0.016±.002
A
0.130 MAX.
E
0.700±0.015
e
.050
L
C +0.002
0.007 -0.001
Notes:
1. Package material: opaque ceramic.
2. All package plating finishes are per MIL-M-38510.
3. Lid is not connected to any electrical potential.
4. It is recommended that package ceramic be mounted to a heat removal rail located in the
printed circuit board. A thermally conductive material such as Mereco XLN-589 or
equivalent should be used.
Figure 15. 36-Lead Flatpack, Dual Cavity
(50-Mil Lead Spacing)
Q
0.070±0.010
(AT CERAMIC BODY)
19
 

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