Notes:
1. All package finishes are per MIL-M-38510.
2. It is recommended that package ceramic be mounted on a heat removal
rail in the printed circuit board. A thermally conductive material such as
MERECO XLN-589 or equivalent should be used.
3. Letter designations are for cross-reference to MIL-M-38510.
Figure 13. 24-Pin Side-Brazed DIP, Single Cavity
17