5962D9568501VPC View Datasheet(PDF) - Intersil
Part Name
Description
Manufacturer
5962D9568501VPC Datasheet PDF : 7 Pages
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Die Characteristics
DIE DIMENSIONS:
65 mils x 50 mils x 19 mils
(1660µm x 1270µm x 483µm)
INTERFACE MATERIALS:
Glassivation:
Type: Nitride
Thickness: 7kÅ ±0.7kÅ
Top Metallization:
Type: Aluminum
Thickness: 16kÅ ±2kÅ
Substrate:
Linear Bipolar, DI
Backside Finish:
Silicon
Metallization Mask Layout
V+
OUT
HS-2520RH
ASSEMBLY RELATED INFORMATION:
Substrate Potential (Powered Up):
Unbiased
ADDITIONAL INFORMATION:
Worst Case Current Density:
<2 x 105 A/cm2
Transistor Count:
40
HS-2520RH
BAL
V-
COMP
BAL
-IN
+IN
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Intersil semiconductor products are sold by description only. Intersil Corporation reserves the right to make changes in circuit design and/or specifications at any time with-
out notice. Accordingly, the reader is cautioned to verify that data sheets are current before placing orders. Information furnished by Intersil is believed to be accurate and
reliable. However, no responsibility is assumed by Intersil or its subsidiaries for its use; nor for any infringements of patents or other rights of third parties which may result
from its use. No license is granted by implication or otherwise under any patent or patent rights of Intersil or its subsidiaries.
For information regarding Intersil Corporation and its products, see web site http://www.intersil.com
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