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5962D9569401VEA(1999) View Datasheet(PDF) - Intersil

Part Name
Description
Manufacturer
5962D9569401VEA Datasheet PDF : 6 Pages
1 2 3 4 5 6
Die Characteristics
DIE DIMENSIONS:
83 mils x 108 mils x 19 mils
INTERFACE MATERIALS:
Glassivation:
Type: Nitride
Thickness: 7kÅ ±0.7kÅ
Top Metallization:
Type: Al
Thickness: 16kÅ ±2kÅ
Metallization Mask Layout
HS-0548RH
HS-0548RH, HS-0549RH
Substrate:
CMOS, DI
ASSEMBLY RELATED INFORMATION:
Substrate Potential:
Floating
ADDITIONAL INFORMATION:
Worst Case Current Density:
1.4 x 105 A/cm2
Transistor Count:
253
HS-0549RH
IN 6 IN 7 IN 8
OUT IN 4 IN 3
IN3B IN4B OUT B
OUT A IN4A IN3A
IN 5
+V
GND
IN 2
IN2B
IN 1
IN1B
-V
+V
IN2A
IN1A
V-
A2
A1 A0
EN
GND
A1 A0
EN
NOTE: Pad Numbers Correspond to DIP Pin Numbers Only
All Intersil semiconductor products are manufactured, assembled and tested under ISO9000 quality systems certification.
Intersil semiconductor products are sold by description only. Intersil Corporation reserves the right to make changes in circuit design and/or specifications at any time with-
out notice. Accordingly, the reader is cautioned to verify that data sheets are current before placing orders. Information furnished by Intersil is believed to be accurate and
reliable. However, no responsibility is assumed by Intersil or its subsidiaries for its use; nor for any infringements of patents or other rights of third parties which may result
from its use. No license is granted by implication or otherwise under any patent or patent rights of Intersil or its subsidiaries.
For information regarding Intersil Corporation and its products, see web site http://www.intersil.com
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