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5962D9568601VPA View Datasheet(PDF) - Intersil

Part Name
Description
Manufacturer
5962D9568601VPA Datasheet PDF : 7 Pages
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Die Characteristics
DIE DIMENSIONS:
65 mils x 57 mils x 19 mils
(1660µm x 1950µm x 483µm)
INTERFACE MATERIALS:
Glassivation:
Type: Nitride
Thickness: 7kÅ ±0.7kÅ
Top Metallization:
Type: Aluminum
Thickness: 16kÅ ±2kÅ
Substrate:
Linear Bipolar, DI
Metallization Mask Layout
V+
HS-2510RH
Backside Finish:
Silicon
ASSEMBLY RELATED INFORMATION:
Substrate Potential (Powered Up):
Unbiased
ADDITIONAL INFORMATION:
Worst Case Current Density:
<2 x 105A/cm2
Transistor Count:
40
Die Attach:
Temperature: CERDIP 460oC (Max)
HS-2510RH
OUT
BAL
V-
COMP
BAL
-IN +IN
All Intersil semiconductor products are manufactured, assembled and tested under ISO9000 quality systems certification.
Intersil semiconductor products are sold by description only. Intersil Corporation reserves the right to make changes in circuit design and/or specifications at any time with-
out notice. Accordingly, the reader is cautioned to verify that data sheets are current before placing orders. Information furnished by Intersil is believed to be accurate and
reliable. However, no responsibility is assumed by Intersil or its subsidiaries for its use; nor for any infringements of patents or other rights of third parties which may result
from its use. No license is granted by implication or otherwise under any patent or patent rights of Intersil or its subsidiaries.
For information regarding Intersil Corporation and its products, see web site http://www.intersil.com
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