ADG774ABRQZ-REEL View Datasheet(PDF) - Analog Devices
Part Name
Description
Manufacturer
ADG774ABRQZ-REEL Datasheet PDF : 16 Pages
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OUTLINE DIMENSIONS
0.197
0.193
0.189
16
1
0.065
0.049
PIN 1
9
0.158
0.154
0.150 0.244
8
0.236
0.228
0.069
0.053
0.010
0.004
COPLANARITY
0.004
0.025
BSC
0.012
0.008
SEATING
PLANE
8°
0°
0.010
0.006
COMPLIANT TO JEDEC STANDARDS MO-137-AB
Figure 29. 16-Lead Shrink Small Outline Package [QSOP]
(RQ-16)
Dimensions shown in inches
0.050
0.016
ADG774A
PIN 1
INDICATOR
3.00
BSC SQ
TOP
VIEW
2.75
BSC SQ
0.50
0.40
0.60 MAX
0.30
0.45
13
12
16 1
EXPOSED
PAD
PIN 1
INDICATOR
*1.65
1.50 SQ
1.35
0.50
BSC
9 (BOTTOM VIEW) 4
8
5
0.25 MIN
12° MAX
0.90
0.85
0.80
SEATING
PLANE
0.30
0.23
0.80 MAX
0.65 TYP
0.05 MAX
0.02 NOM
0.20 REF
1.50 REF
0.18
*COMPLIANT TO JEDEC STANDARDS MO-220-VEED-2
EXCEPT FOR EXPOSED PAD DIMENSION.
Figure 30. 16-Lead Lead Frame Chip Scale Package [LFCSP_VQ]
(CP-16-3)
Dimensions shown in millimeters
ORDERING GUIDE
Model
ADG774ABRQ
ADG774ABRQ-REEL
ADG774ABRQ-REEL7
ADG774ABRQZ1
ADG774ABRQZ-REEL1
ADG774ABRQZ-REEL71
ADG774ABCPZ-REEL
1 Z = Pb-free part.
Temperature Range
−40°C to +85°C
−40°C to +85°C
−40°C to +85°C
−40°C to +85°C
−40°C to +85°C
−40°C to +85°C
−40°C to +85°C
Package Description
16-Lead Shrink Small Outline Package [QSOP]
16-Lead Shrink Small Outline Package [QSOP]
16-Lead Shrink Small Outline Package [QSOP]
16-Lead Shrink Small Outline Package [QSOP]
16-Lead Shrink Small Outline Package [QSOP]
16-Lead Shrink Small Outline Package [QSOP]
16-Lead Lead Frame Chip Scale Package [LFCSP_VQ]
Package Option
RQ-16
RQ-16
RQ-16
RQ-16
RQ-16
RQ-16
CP-16-3
Rev. B | Page 13 of 16
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