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OPD1616N Datasheet - Kodenshi

Part Name
Description
MFG CO.
OPD1616N
Kodenshi
Kodenshi Auk Co., LTD Kodenshi
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OPD1616N image

High Speed Sensitivity

Structure
1.1 Chip Size : 1.60mm X 1.60mm
1.2 Chip Thickness : 400±20um
1.3 Metallization : Top - Al, Bottom - Au
1.4 Passivation : Silicon Nitride
1.5 Bonding Pad Size
   - Cathode(Top) : 300um X 300um
   - Anode(Bottom)
1.6 Active Area : 1.40mm X 1.40mm

 

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