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CPD98V Datasheet - Central-Semiconductor

Part Name
Description
MFG CO.
Other PDF
  2006  
PDF
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CPD98V image

PROCESS DETAILS
   Process EPITAXIAL PLANAR
   Die Size 20 x 20 MILS
   Die Thickness 7.1 MILS
   Anode Bonding Pad Area 16 x 16 MILS
   Top Side Metalization Al - 20,000Å
   Back Side Metalization Au - 12,000Å

 

Part Name
Description
PDF
MFG CO.
Connector for Internal Serial Transmission
Japan Aviation Electronics Industry, Ltd.
1550 nm LASER DIODE MODULES UNCOOLED MQW-FP LD WITH PIGTAIL
Optoway Technology
1550 nm DFB LASER DIODE MODULES UNCOOLED MQW DFB LD WITH PIGTAIL
Optoway Technology
1310 nm LASER DIODE MODULES UNCOOLED MQW-FP LD WITH PIGTAIL
Optoway Technology
1550 nm DFB LASER DIODE MODULES UNCOOLED MQW DFB LD WITH PIGTAIL
Optoway Technology
0.8mm(.031inch) Contact Spacing, PCB to PCB SMT Connectors
Unspecified
Stepper Motor Driver IC’s
Panasonic Corporation
1310 nm DFB LASER DIODE MODULES UNCOOLED MQW DFB LD WITH PIGTAIL
Optoway Technology
1310 nm LASER DIODE MODULES UNCOOLED MQW-FP LD WITH PIGTAIL
Optoway Technology
ENHANCED DIFFERENTIAL RECEIVER
Micrel

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