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CPD92 Datasheet - Central-Semiconductor

Part Name
Description
MFG CO.
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PROCESS DETAILS
   Process EPITAXIAL PLANAR
   Die Size 9.0 x 9.0 MILS
   Die Thickness 7.9 MILS
   Anode Bonding Pad Area 4.8 MILS DIAMETER
   Top Side Metalization Al - 30,000Å
   Back Side Metalization Au - 18,000Å

 

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