EL5420CR-T7 View Datasheet(PDF) - Elantec -> Intersil
Part Name
Description
Manufacturer
EL5420CR-T7 Datasheet PDF : 13 Pages
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EL5220C, EL5420C
12MHz Rail-to-Rail Input-Output Op Amps
1V
100µs
VS=±2.5V
TA=25°C
AV=1
VIN=6VP-P
1V
Figure 2. Operation with Beyond-the-Rails
Input
Power Dissipation
With the high-output drive capability of the EL5220C
and EL5420C amplifiers, it is possible to exceed the
125°C “absolute-maximum junction temperature” under
certain load current conditions. Therefore, it is important
to calculate the maximum junction temperature for the
application to determine if load conditions need to be
modified for the amplifier to remain in the safe operating
area.
The maximum power dissipation allowed in a package is
determined according to:
PDMAX
=
T----J---M-----A-----X------–----T----A-----M-----A-----X--
ΘJA
where:
TJMAX = Maximum Junction Temperature
TAMAX= Maximum Ambient Temperature
θJA = Thermal Resistance of the Package
PDMAX = Maximum Power Dissipation in the Package
The maximum power dissipation actually produced by
an IC is the total quiescent supply current times the total
power supply voltage, plus the power in the IC due to the
loads, or:
PDMAX = Σi × [VS × ISMAX + (VS+ – VOUTi ) × ILOADi]
when sourcing, and:
PDMAX = Σi × [VS × ISMAX + (VOUTi – VS- ) × ILOADi]
when sinking.
where
i = 1 to 2 for Dual and 1 to 4 for Quad
VS = Total Supply Voltage
ISMAX = Maximum Supply Current Per Amplifier
VOUTi = Maximum Output Voltage of the Application
ILOADi = Load Current
If we set the two PDMAX equations equal to each other,
we can solve for RLOADi to avoid device overheat. Fig-
ures 3, 4, and 5 provide a convenient way to see if the
device will overheat. The maximum safe power dissipa-
tion can be found graphically, based on the package type
and the ambient temperature. By using the previous
equation, it is a simple matter to see if PDMAX exceeds
the device's power derating curves. To ensure proper
operation, it is important to observe the recommended
derating curves in Figures 3, 4, and 5.
JEDEC JESD51-7 High Effective Thermal Conductivity (4-
Layer) Test Board
LPP exposed diepad soldered to PCB per JESD51-5
1200
1.136W
1000 1.0W
800 870mW
TSSOP14
θJA=100°C/W
MAX TJ=125°C
SO14
600
θJA=88°C/W
MSOP8
400
θJA=115°C/W
200
0
0
25
50
75 85 100
125
150
Ambient Temperature (°C)
Figure 3. Package Power Dissipation vs
Ambient Temperature
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