AD9744ACPZ1 View Datasheet(PDF) - Analog Devices
Part Name
Description
Manufacturer
AD9744ACPZ1 Datasheet PDF : 32 Pages
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PIN 1
INDICATOR
5.00
BSC SQ
TOP
VIEW
4.75
BSC SQ
12° MAX
0.80 MAX
0.65 TYP
0.60 MAX
0.50
BSC
0.50
0.40
0.30
0.60 MAX
25
24
32 1
EXPOSED
PAD
(BOTTOM VIEW)
PIN 1
INDICATOR
3.45
3.30 SQ
3.15
17
16
98
0.25 MIN
3.50 REF
0.05 MAX
1.00
0.02 NOM
0.85
0.30
0.80
SEATING
0.23
0.20 REF
PLANE
0.18
COPLANARITY
0.08
COMPLIANT TO JEDEC STANDARDS MO-220-VHHD-2
Figure 60. 32-Lead Lead Frame Chip Scale Package [LFCSP]
5 mm × 5 mm Body (CP-32-3)
Dimensions shown in millimeters
ORDERING GUIDE
Model
AD9744AR
AD9744ARRL
AD9744ARZ1
AD9744ARZRL1
AD9744ARU
AD9744ARURL7
AD9744ARUZ1
AD9744ARUZRL71
AD9744ACP
AD9744ACPRL7
AD9744ACPZ1
AD9744ACPZRL71
AD9744-EB
AD9744ACP-PCB
1 Z = Pb-free part.
Temperature Range
−40°C to +85°C
−40°C to +85°C
−40°C to +85°C
−40°C to +85°C
−40°C to +85°C
−40°C to +85°C
−40°C to +85°C
−40°C to +85°C
−40°C to +85°C
−40°C to +85°C
−40°C to +85°C
−40°C to +85°C
Package Description
28-Lead, 300-Mil SOIC
28-Lead, 300-Mil SOIC
28-Lead, 300-Mil SOIC
28-Lead, 300-Mil SOIC
28-Lead TSSOP
28-Lead TSSOP
28-Lead TSSOP
28-Lead TSSOP
32-Lead LFCSP
32-Lead LFCSP
32-Lead LFCSP
32-Lead LFCSP
Evaluation Board (SOIC)
Evaluation Board (LFCSP)
Package Options
RW-28
RW-28
RW-28
RW-28
RU-28
RU-28
RU-28
RU-28
CP-32-3
CP-32-3
CP-32-3
CP-32-3
AD9744
Rev. B | Page 31 of 32
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