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FDN335N View Datasheet(PDF) - Fairchild Semiconductor

Part Name
Description
Manufacturer
FDN335N
Fairchild
Fairchild Semiconductor Fairchild
FDN335N Datasheet PDF : 8 Pages
1 2 3 4 5 6 7 8
Electrical Characteristics
Symbol
Parameter
TA = 25°C unless otherwise noted
Test Conditions
Min Typ Max Units
Off Characteristics
BVDSS
Drain-Source Breakdown Voltage
BVDSS
TJ
IDSS
Breakdown Voltage Temperature
Coefficient
Zero Gate Voltage Drain Current
IGSSF
Gate-Body Leakage Current,
Forward
IGSSR
Gate-Body Leakage Current,
Reverse
On Characteristics (Note 2)
VGS(th)
Gate Threshold Voltage
VGS(th)
TJ
RDS(ON)
Gate Threshold Voltage
Temperature Coefficient
Static Drain-Source
On-Resistance
ID(on)
On-State Drain Current
gFS
Forward Transconductance
VGS = 0 V, ID = 250 µA
20
ID = 250 µA,Referenced to 25°C
14
V
mV/°C
VDS = 16 V, VGS = 0 V
VGS = 8 V, VDS = 0 V
1
µA
100
nA
VGS = -8 V, VDS = 0 V
-100 nA
VDS = VGS, ID = 250 µA
0.4 0.9
ID = 250 µA,Referenced to 25°C
-3
1.5
V
mV/°C
VGS = 4.5 V, ID = 1.7 A
0.055 0.070
VGS = 4.5 V, ID = 1.7 A,TJ = 125°C
0.079 0.120
VGS = 2.5 V, ID = 1.5 A
0.078 0.100
VGS = 4.5 V, VDS = 5 V
8
A
VDS = 5 V, ID = 1.5 A
7
S
Dynamic Characteristics
Ciss
Input Capacitance
Coss
Output Capacitance
Crss
Reverse Transfer Capacitance
VDS = 10 V, VGS = 0 V,
f = 1.0 MHz
310
pF
80
pF
40
pF
Switching Characteristics
td(on)
Turn-On Delay Time
tr
Turn-On Rise Time
td(off)
Turn-Off Delay Time
tf
Turn-Off Fall Time
Qg
Total Gate Charge
Qgs
Gate-Source Charge
Qgd
Gate-Drain Charge
(Note 2)
VDD = 10 V, ID = 1 A,
VGS = 4.5 V, RGEN = 6
VDS = 10 V, ID = 1.7 A,
VGS = 4.5 V,
5
15
ns
8.5
17
ns
11
20
ns
3
10
ns
3.5
5
nC
0.55
nC
0.95
nC
Drain-Source Diode Characteristics and Maximum Ratings
IS
Maximum Continuous Drain-Source Diode Forward Current
VSD
Drain-Source Diode Forward
VGS = 0 V, IS = 0.42 A (Note 2)
Voltage
0.42
A
0.7 1.2
V
Notes:
1: RθJA is the sum of the junction-to-case and case-to-ambient thermal resistance where the case thermal reference is defined as the solder mounting
surface of the drain pins. RθJC is guaranteed by design while RθCA is determined by the user's board design.
a) 250°C/W when
mounted on a 0.02 in2
Pad of 2 oz. Cu.
Scale 1 : 1 on letter size paper
2: Pulse Test: Pulse Width 300 µs, Duty Cycle 2.0%
b) 270°C/W when mounted
on a minimum pad.
FDN335N Rev. C
 

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