GRM219R60J475ME32D View Datasheet(PDF) - Murata Manufacturing

Part Name

Description

Manufacturer

GRM219R60J475ME32D

Chip Multilayer Ceramic Capacitors for General Purpose

Murata Manufacturing 

4-1.Reflow Soldering

1. When sudden heat is applied to the components, the mechanical strength of the components will

decrease because a sudden temperature change causes deformation inside the components.

In order to prevent mechanical damage to the components, preheating is required for both the

components and the PCB.

Preheating conditions are shown in table 1.

It is required to keep the temperature differential between the solder and the components

surface (ΔT) as small as possible.

2. When components are immersed in solvent after mounting, be sure to maintain the temperature

difference (ΔT) between the component and the solvent within the range shown in the table 1.

Table 1

Series

GRM

GRM

Chip　Dimension(L/W)　Code

01/02/MD/03/15/

18/JN/21/31

Temperature Differential

ΔT≦190℃

32/43/55

ΔT≦130℃

Recommended Conditions

Peak Temperature

Lead Free Solder

240 to 260℃

Atmosphere

Lead Free Solder: Sn-3.0Ag-0.5Cu

Air or N2

[Standard Conditions for Reflow Soldering]

Temperature(℃)

Peak Temperature

220℃

ΔT

190℃

170℃

150℃

Soldering

Gradual

Cooling

Preheating

Time

60 to 120 s 30 to 60 s

[Allowable Reflow Soldering Temperature and Time]

280

270

260

250

240

230

220 0

30

60

90

120

Soldering Time(s)

In the case of repeated soldering, the accumulated

soldering time must be within the range shown above.

3. When a capacitor is mounted at a temperature lower than the peak reflow temperature recommended by the solder manufacturer, the following quality problems can occur.

Consider factors such as the placement of peripheral components and the reflow temperature setting to prevent the capacitor’s reflow temperature from dropping below the peak temperature specified.

Be sure to evaluate the mounting situation beforehand and verify that none of the following problems occur.

･Drop in solder wettability

･Solder voids

･Possible occurrence of whiskering

･Drop in bonding strength

･Drop in self-alignment properties

･Possible occurrence of tombstones and/or shifting on the land patterns of the circuit board

4. Optimum Solder Amount for Reflow Soldering

　4-1. Overly thick application of solder paste results in a excessive solder fillet height.

This makes the chip more susceptible to mechanical and thermal stress on the board and may cause the chips to crack.

4-2. Too little solder paste results in a lack of adhesive strength on the termination, which may result in chips breaking loose from the PCB.

4-3. Please confirm that solder has been applied smoothly to the termination.

Inverting the PCB

Make sure not to impose any abnormal mechanical shocks to the PCB.

GRM219R60J475ME32-01A

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