GRM219R60J475KE32 View Datasheet(PDF) - Murata Manufacturing

Part Name

Description

Manufacturer

GRM219R60J475KE32

Chip Multilayer Ceramic Capacitors for General Purpose

Murata Manufacturing 

4-3.Correction of Soldered Portion

　When sudden heat is applied to the capacitor, distortion caused by the large temperature difference occurs internally, and can be the cause of cracks.

Capacitors also tend to be affected by mechanical and thermal stress depending on the board preheating temperature or the soldering fillet shape, and can be the cause of cracks.

Please refer to "1. PCB Design" or "3. Optimum solder amount" for the solder amount and the fillet shapes.

1. Correction with a Soldering Iron

　1-1. In order to reduce damage to the capacitor, be sure to preheat the capacitor and the mounting board.

Preheat to the temperature range shown in Table 3. A hot plate, hot air type preheater, etc. can be used for preheating.

1-2. After soldering, do not allow the component/PCB to cool down rapidly.

1-3. Perform the corrections with a soldering iron as quickly as possible. If the soldering iron is applied too long, there is a possibility of

causing solder leaching on the terminal electrodes, which will cause deterioration of the adhesive strength and other problems.

Table 3

Series

GRM

Chip　Dimension

(L/W)　Code

03/15/18/JN/21/31

Temperature of

Soldering Iron Tip

350℃ max.

Preheating

Temperature

150℃ min.

Temperature

Differential(ΔT)

ΔT≦190℃

Atmosphere

Air

GRM

32/43/55

280℃ max.

150℃ min.

ΔT≦130℃

Air

Lead Free Solder: Sn-3.0Ag-0.5Cu

* Please manage Δ T in the temperature of soldering iron and the preheating temperature.

2. Correction with Spot Heater

　Compared to local heating with a soldering iron, hot air heating by a spot heater heats the overall component and board,

therefore, it tends to lessen the thermal shock. In the case of a high density mounted board, a spot heater can also prevent concerns

of the soldering iron making direct contact with the component.

2-1. If the distance from the hot air outlet of the spot heater to the component is too close, cracks may occur due to thermal shock.

To prevent this problem, follow the conditions shown in Table 4.

2-2. In order to create an appropriate solder fillet shape, it is recommended that hot air be applied at the angle shown in Figure 1.

Table 4

Distance

Hot Air Application angle

5mm or more

45° *Figure 1

Hot Air Temperature Nozzle Outlet 400°C max.

Less than 10 s

Application Time

(3216M / 1206 size or smaller)

Less than 30 s

(3225M / 1210 size or larger)

(3216M , 3225M : Metric size code)

[Figure 1]

One-hole Nozzle

an Angle of 45

3. Optimum solder amount when re-working with a soldering iron

3-1. If the solder amount is excessive, the risk of cracking is higher during board bending or any other stressful condition.

Too little solder amount results in a lack of adhesive strength on the termination, which may result in chips breaking loose from the PCB.

Please confirm that solder has been applied smoothly is and rising to the end surface of the chip.

3-2. A soldering iron with a tip of ø3mm or smaller should be used.

It is also necessary to keep the soldering iron from touching the components during the re-work.

3-3. Solder wire with ø0.5mm or smaller is required for soldering.

Solder Amount

in section

GRM219R60J475KE32-01A

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