MCP1811A/11B/12A/12B
5-Lead Plastic Small Outline Transistor (OT) [SOT23]
Note: For the most current package drawings, please see the Microchip Packaging Specification located at
http://www.microchip.com/packaging
c
T
L
L1
VIEW A-A
SHEET 1
Units
MILLIMETERS
Dimension Limits
MIN
NOM
MAX
Number of Pins
N
5
Pitch
e
0.95 BSC
Outside lead pitch
e1
1.90 BSC
Overall Height
A
0.90
-
1.45
Molded Package Thickness
A2
0.89
-
1.30
Standoff
A1
-
-
0.15
Overall Width
E
2.80 BSC
Molded Package Width
E1
1.60 BSC
Overall Length
D
2.90 BSC
Foot Length
L
0.30
-
0.60
Footprint
L1
0.60 REF
Foot Angle
I
0°
-
10°
Lead Thickness
c
0.08
-
0.26
Notes:
Lead Width
b
0.20
-
0.51
1. Dimensions D and E1 do not include mold flash or protrusions. Mold flash or
protrusions shall not exceed 0.25mm per side.
2. Dimensioning and tolerancing per ASME Y14.5M
BSC: Basic Dimension. Theoretically exact value shown without tolerances.
REF: Reference Dimension, usually without tolerance, for information purposes only.
Microchip Technology Drawing C04-091-OT Rev E Sheet 2 of 2
2018-2019 Microchip Technology Inc.
DS20006088B-page 38