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CX02066DIEWP View Datasheet(PDF) - Conexant Systems

Part Name
Description
Manufacturer
CX02066DIEWP Datasheet PDF : 12 Pages
1 2 3 4 5 6 7 8 9 10 Next Last
Package Outline 24L BCC+
TOP VIEW
(PIN 1 CORNER)
X
4.00±0.10
CX02066
3.3 Volt Laser Driver IC for Applications to 3 Gbps
PACKAGE INFORMATION
BOTTOM VIEW
0.50 TYP.
3.15
0.50±0.10
2.20
C.L(PKG.)
"B"
"A"(PIN 1 CORNER)
0.15
3.20
"C"
Y
Thermal performance <50°C/W
BCC Pads
Terminal
0.4mm
0.3mm
PCB Land
0.1
mm
SMT MOUNTING GUIDELINES
Solder Resist Mask
0.025mm
Paste Mask
0.2mm
1.3
mm
0.025mm
Corner Pads
Terminal
0.35mm
PCB Land
0.025mm
0.025mm
0.025mm
Solder Resist Mask
0.025mm
0.45mm
1.0mm
0.45mm
0.025mm
1.0mm
0.025mm
Exposed Central Pad (connected to ground plane)
Terminal
PCB Land
Solder Resist Mask
0.1mm
0.1mm
0.025mm
2.1mm
0.2mm
Paste Mask
0.125mm
0.125mm
0.55mm
0.55mm
Paste Mask
1.26mm
1.26mm
2.1mm
0.1mm
0.1mm
ADVANCED INFORMATION - REV FF
0.025mm
PAGE -9-
0.025mm
CX02066
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