0273.015 View Datasheet(PDF) - Littelfuse, Inc
Part Name
Description
Manufacturer
0273.015 Datasheet PDF : 3 Pages
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Introduction toRCaidricauliLt eParodtFeuctsieosn
MICRO™ > Very Fast-Acting > 272/273/274/2T7r8a/2n7s9ieSnetorileosgy
Temperature Rerating Curve
Average Time Current Curves
Soldering Parameters - Wave Soldering
300
280
260
240
220
200
180
160
140
120
100
80
60
40
20
0
Time (Seconds)
Preheat Time
Dwell Time
Cooling Time
100
10
1
0.1
0.01
0.001
0.005 0.01
0.1
1
10
100
CURRENT IN AMPERES
Recommended Process Parameters:
Wave Parameter
Preheat:
(Depends on Flux Activation Temperature)
Temperature Minimum:
Temperature Maximum:
Preheat Time:
Lead-Free Recommendation
(Typical Industry Recommendation)
100° C
150° C
60-180 seconds
Solder Pot Temperature:
260° C Maximum
Solder Dwell Time:
2-5 seconds
Recommended Hand-Solder Parameters:
Solder Iron Temperature: 350° C +/- 5°C
Heating Time: 5 seconds max.
Note: These devices are not recommended for IR or
Convection Reflow process.
272/273/274/278/279 Series
132
Revised: January 7, 2009
© 2009 Littelfuse, Inc.
Specifications are subject to change without notice.
Please refer to www.littelfuse.com/series/272.html, /273.html, /274.html,
/278.html or /279.html for current information.
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