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GS881E18BT-150I View Datasheet(PDF) - Giga Semiconductor

Part NameDescriptionManufacturer
GS881E18BT-150I 512K x 18, 256K x 32, 256K x 36 9Mb Sync Burst SRAMs GSI
Giga Semiconductor GSI
GS881E18BT-150I Datasheet PDF : 34 Pages
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GS881E18B(T/D)/GS881E32B(D)/GS881E36B(T/D)
TQFP Package Drawing
100-Pin TQFP Package Drawing
Symbol Description Min. Nom. Max
θ
L
L1
c
A1
Standoff
0.05 0.10 0.15
A2
Body Thickness 1.35 1.40 1.45
b
Lead Width
0.20 0.30 0.40
c
Lead Thickness 0.09
0.20
D Terminal Dimension 21.9 22.0 22.1
e
D1
Package Body 19.9 20.0 20.1
E
Terminal Dimension 15.9 16.0 16.1
b
E1
Package Body 13.9 14.0 14.1
e
Lead Pitch
0.65
L
Foot Length
0.45 0.60 0.75
L1
Lead Length
1.00
A1
Y
Coplanarity
A2
0.10
E1
E
θ
Lead Angle
0°
7°
Notes:
1. All dimensions are in millimeters (mm).
2. Package width and length do not include mold protrusion.
Rev: 1.00b 12/2002
30/34
© 2001, Giga Semiconductor, Inc.
Specifications cited are subject to change without notice. For latest documentation see http://www.gsitechnology.com.
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