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GS880E18AT-133 View Datasheet(PDF) - Giga Semiconductor

Part Name
Description
Manufacturer
GS880E18AT-133 Datasheet PDF : 24 Pages
First Prev 21 22 23 24
GS880E18/32/36AT-250/225/200/166/150/133
TQFP Package Drawing (Package T)
Symbol Description Min. Nom. Max
θ
L
L1
c
A1
Standoff
0.05 0.10 0.15
A2
Body Thickness 1.35 1.40 1.45
b
Lead Width
0.20 0.30 0.40
c
Lead Thickness 0.09 0.20
D Terminal Dimension 21.9 22.0 22.1
e
D1
Package Body 19.9 20.0 20.1
E
Terminal Dimension 15.9 16.0 16.1
b
E1
Package Body 13.9 14.0 14.1
e
Lead Pitch
0.65
L
Foot Length
0.45 0.60 0.75
L1
Lead Length
1.00
A1
Y
Coplanarity
0.10
A2
E1
θ
Lead Angle
0° 7°
E
Notes:
1. All dimensions are in millimeters (mm).
2. Package width and length do not include mold protrusion.
Rev: 1.03 11/2004
21/24
Specifications cited are subject to change without notice. For latest documentation see http://www.gsitechnology.com.
© 2001, GSI Technology
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