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BQ25504 View Datasheet(PDF) - Texas Instruments

Part NameDescriptionManufacturer
BQ25504 Ultra Low-Power Boost Converter With Battery Management for Energy Harvester Applications Texas-Instruments
Texas Instruments Texas-Instruments
BQ25504 Datasheet PDF : 36 Pages
First Prev 31 32 33 34 35 36
RGT0016C
EXAMPLE BOARD LAYOUT
VQFN - 1 mm max height
PLASTIC QUAD FLATPACK - NO LEAD
16X (0.6)
1
16X (0.24)
12X (0.5)
4
( 0.2) TYP
VIA
(R0.05)
ALL PAD CORNERS
( 1.68)
SYMM
16
13
12
SYMM
(0.58)
TYP
(2.8)
9
5
8
(0.58) TYP
(2.8)
LAND PATTERN EXAMPLE
SCALE:20X
0.07 MAX
ALL AROUND
METAL
0.07 MIN
ALL AROUND
SOLDER MASK
OPENING
SOLDER MASK
OPENING
METAL UNDER
SOLDER MASK
NON SOLDER MASK
DEFINED
(PREFERRED)
SOLDER MASK
DEFINED
SOLDER MASK DETAILS
4222419/B 11/2016
NOTES: (continued)
4. This package is designed to be soldered to a thermal pad on the board. For more information, see Texas Instruments literature
number SLUA271 (www.ti.com/lit/slua271).
5. Vias are optional depending on application, refer to device data sheet. If any vias are implemented, refer to their locations shown
on this view. It is recommended that vias under paste be filled, plugged or tented.
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