MPX4250A View Datasheet(PDF) - Freescale Semiconductor

Part Name

Description

Manufacturer

MPX4250A

Integrated Silicon Pressure Sensor Manifold Absolute Pressure Sensor On-Chip Signal Conditioned, Temperature Compensated and Calibrated

Freescale Semiconductor 

INFORMATION FOR USING THE SMALL OUTLINE PACKAGE (CASE 482)

MINIMUM RECOMMENDED FOOTPRINT FOR SURFACE MOUNTED APPLICATIONS

Surface mount board layout is a critical portion of the total

solder reflow process. It is always recommended to design

design. The footprint for the surface mount packages must be

boards with a solder mask layer to avoid bridging and

the correct size to ensure proper solder connection interface

shorting between solder pads.

between the board and the package. With the correct

Footprint, the packages will self align when subjected to a

0.660

16.76

0.100 TYP 8X

2.54

0.060 TYP 8X

1.52

0.300

7.62

0.100 TYP 8X

2.54

inch

mm SCALE 2:1

Figure 5. SOP Footprint (Case 482)

MPX4250A

6

Sensors

Freescale Semiconductor

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