SI-3000KM View Datasheet(PDF) - Allegro MicroSystems
Part Name
Description
Manufacturer
SI-3000KM
Allegro MicroSystems
SI-3000KM Datasheet PDF : 12 Pages
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qSI-3000KM Series
sReference Data
100
90
80
70
60
50
40
10
1.5
1
0.5
0
10
Copper Foil Area-Thermal Resistance
Glass-epoxy substrate : 30×30mm
100
Copper Foil Area (mm2)
1000
Copper Foil Area-Power Dissipation
Glass-epoxy substrate : 30×30mm
Ta=25°C
40°C
60°C
85°C
100
Copper Foil Area (mm2)
1000
• Obtaining Junction Temperature
Temperature of lead part of GND terminal: Measure TC
with thermocouple. Substitute value to the following for-
mula to obtain the junction temperature
Tj=PD × θj–C + TC ( θj–C = 6°C/W)
Case temperature
measurement point
sExample of Soldering Pattern Design
(Unit : mm)
6.0
6.1
2.4
5.88
2.5
1.27
0.47 0.8
7
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