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TPS79901-EP View Datasheet(PDF) - Texas Instruments

Part NameTPS79901-EP TI
Texas Instruments TI
Description200-mA, Low-Quiescent Current, Ultra-Low-Noise, High-PSRR Low-Dropout Linear Regulator
TPS79901-EP Datasheet PDF : 27 Pages
1 2 3 4 5 6 7 8 9 10 Next Last
TPS79901-EP
SBVS330A – SEPTEMBER 2017 – REVISED OCTOBER 2017
www.ti.com
6 Specifications
6.1 Absolute Maximum Ratings
over operating junction temperature range (unless otherwise noted)(1)
Voltage (2)
Current
Temperature
IN
EN
OUT
OUT
Operating virtual junction, TJ
Storage temperature range, Tstg
MIN
MAX
–0.3
7
–0.3
VIN + 0.3
–0.3
VIN + 0.3
Internally limited
–55
150
–55
150
UNIT
V
mA
°C
(1) Stresses beyond those listed under Absolute Maximum Ratings may cause permanent damage to the device. These are stress ratings
only, which do not imply functional operation of the device at these or any other conditions beyond those indicated under Recommended
Operating Conditions. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.
(2) All voltages are with respect to network ground terminal.
6.2 ESD Ratings
V(ESD)
Electrostatic
discharge
Human-body model (HBM), per ANSI/ESDA/JEDEC JS-001, all pins(1)
Charged-device model (CDM), per JEDEC specification JESD22-C101, all pins(2)
VALUE
±1500
±500
(1) JEDEC document JEP155 states that 500-V HBM allows safe manufacturing with a standard ESD control process.
(2) JEDEC document JEP157 states that 250-V CDM allows safe manufacturing with a standard ESD control process.
UNIT
V
6.3 Recommended Operating Conditions
over operating junction temperature range (unless otherwise noted)
VIN
Input voltage(1)
IOUT
Output current
TJ
Operating junction temperature
(1) Minimum VIN = VOUT + VDO or 2.7 V, whichever is greater.
MIN
NOM
MAX UNIT
2.7
6.5
V
0.5
200
mA
–55
125
°C
6.4 Thermal Information
THERMAL METRIC(1)
TPS799
DRV (SON)
UNIT
6 PINS
RθJA
RθJC(top)
RθJB
ψJT
ψJB
RθJC(bot)
Junction-to-ambient thermal resistance
Junction-to-case (top) thermal resistance
Junction-to-board thermal resistance
Junction-to-top characterization parameter
Junction-to-board characterization parameter
Junction-to-case (bottom) thermal resistance
74.2
58.8
145.9
0.2
54.4
7.2
°C/W
°C/W
°C/W
°C/W
°C/W
°C/W
(1) For more information about traditional and new thermal metrics, see the IC Package Thermal Metrics application report, SPRA953.
4
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